Investment strategy – Rehm business centre
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Investment strategy – Rehm business centre

Rehm Thermal Systems continues to invest in its headquarters in Blaubeuren: Investment in personnel and systems will go ahead thanks to continually good business performance and positive future prospects. In the last five years alone, the number of permanent employees has increased from 206 to 302. ‘With all these new positions, space is becoming scarce….

3-dimensional soldering process for a MID (molded interconnect device) application
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3-dimensional soldering process for a MID (molded interconnect device) application

After having described the influence of aperture variations and vacuum on the number of voids and void content in BTCs (bottom terminated components) in part 1 and part 2, a further advantage of the targeted use of vacuum is shown in part 3. As a result of the uniform distribution of the vapor during the…

What are the benefits of soldering with vacuum profiles?
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What are the benefits of soldering with vacuum profiles?

Now that the issue of soldering with vacuum profiles has been introduced in part 1, we’ll take a closer look at the process and discuss the obtained soldering results in part 2. Figure 1 shows the overall layout of the test board, although only the components with ground connection will be considered for this evaluation….

Globally Networked – Controlled as if by Magic? – Industry 4.0
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Globally Networked – Controlled as if by Magic? – Industry 4.0

More and More Public Focus on Industry 4.0 Initiatives During the age of computer-controlled production sequences, abbreviations like CAM, CAD and CNC are a common part of manufacturing reality. When the term Industry 4.0 made its first public appearance at the 2011 Hanover Trade Fair, the associated content was new to only a certain extent….

Press Release – The benefits of soldering with vacuum profiles
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Press Release – The benefits of soldering with vacuum profiles

What are the benefits of soldering with vacuum profiles? Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, i.e. the reduction or elimination of cavities in the connection technology used between component connectors and connector pads. New challenges evolve on a daily basis due to the relentless introduction of new…

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